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The turret-style chip shooter and the gantry-style or flexible fine-pitch (FFP) machines have both been used extensively in the assembly of consumer electronics, telecommunications, mainframe and server computers, as well as for lower volume, high-reliability electronic products However, the demands for even higher production volumes as well as the flexibility to change product lines rapidly have caused manufacturers to consider alternative machine architectures that include high-speed stepper motors and optical sensors as well as highly parallel methodologies that place multiple components at the same time 403331 Turret Systems (Passive Devices) The basic turret or chip shooter has been used to place passive components (ie, capacitors, resistors, etc) since the early development of surface-mount technology A photograph of the turret head and schematic diagram of its operation are shown in Fig 4020 Multiple heads are positioned around a stationary, horizontally rotating turret. rdlc pdf 417 PDF417 Barcode Creating Library for RDLC Reports | Generate ...
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Free trial package available to insert PDF - 417 barcode image into Client Report RDLC . FIGURE 40.20 Turret head used to retrieve chip components from a tape and place them on the circuit board. (Photo courtesy of Universal Instruments.) well as an increased demand for placing bare die (flip-chip) components on more densely populated circuit boards. Equipment manufacturers and users must continually address new package configurations with different I/O geometries. 40.3.3.3.2 Gantry Systems (Active Devices). The gantry-style architecture differs from the turret because the printed circuit board is fixed in place and the moving gantry locates the TABLE 40.3 Capabilities of Turret Chip Placement Technology Property Part range Part capacity Placement speed Capabilities Range 0201 (English) passive chip devices to 10 mm area-array packages Several hundreds 25,000 40,000 CPH* 1. Handle both chips and small area-array packages. 2. Moving turret and PCB to increase placement speed. 3. Flexibility of using either tape or bulk part supply. rdlc pdf 417 How to add Barcode to Local Reports ( RDLC ) before report ...
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Barcode Control SDK supports generating Data Matrix, QR Code, PDF - 417 barcodes in RDLC Local Report using VB and C# class library both in ASP.NET and ... component over the correct position (see Fig. 40.21). The part feeder is stationary. The gantry method is typically used to place larger components (e.g., SOICs, PLCCs, etc.). Several attributes of gantry technology are listed in Table 40.4. Several equipment variations can be specified to increase the variety of parts placed on the circuit board. Each gantry is made to accommodate different parts when equipped with a multispindle placement head. The placement head is positioned at each feeder location to receive a part. Then, the head moves the component to the upward-looking vision station for inspection FIGURE 40.21 Gantry architecture used for placing larger components such as SOICs, PLCCs, and areaarray packages. (Photo courtesy of Universal Instruments.) TABLE 40.4 Capabilities of Gantry Technology Property Part range Part capacity Placement speed Capabilities Range Full SMT (SOD, SOT, SOIC, PLCC, CCGA, BGA), direct-chip attach (DCA), and odd-form components. Several hundreds 5,000 15,000 CPH* 1. Oversized and odd-form parts placed with very high accuracy. 2. Moving gantry, fixed PCB and feeders. 3. Flexibility of using tape, tube, bulk, and tray part supplies. followed by its placement on the printed circuit board. A second option is a placement machine made with dual gantries, each placing a single component type or multiple components with the spindle head option. Several features in gantry-style equipment allow component placement speeds to approach those of turret systems in high-speed models. See Table 40.5 for the performance 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. I like to help others learn by teaching or instructing them. TABLE 40.5 Capabilities of High-Speed Gantry Technology Property Part range Part capacity Placement speed Capabilities Range Full SMT (Passives, SOD, SOT, SOIC, PLCC, CCGA, BGA), direct-chip attach (DCA), and odd-form components. Several hundreds 15,000 21,000 CPH* 1. Oversized and odd-form parts placed with very high accuracy. 2. Oversized board capacity. 3. High volumes of tape, tube, bulk, and tray part supplies.
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