rdlc data matrix

rdlc data matrix

rdlc data matrix

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FIGURE 40.15 Pin transfer technique: (a) The pin is brought down to the adhesive reservoir; (b) the pin is immersed in the adhesive; (c) the pin is withdrawn from the reservoir with a repeatable quantity of adhesive; (d) the pin is positioned on the circuit board, allowing the adhesive to contact the surface; (e) the pin is withdrawn from the surface, leaving behind a well-controlled volume of adhesive.

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and fluxes; it does not work as well with solder paste A pin is dipped into a reservoir of the adhesive or flux The length and diameter of the pin determine the quantity of material that is picked up upon its withdrawal from the reservoir The pin is then lowered to a position just above the surface of the printed circuit board that allows the flux or adhesive to contact the circuit board Surface tension causes a portion of the adhesive or flux to be deposited on the printed circuit board It is very important that the pin does not touch the board because this will cause inconsistent dot sizes and shapes This system requires the substrate to be relatively flat and free from distortion.

The nature of the pin array can also allow for adhesive to be applied to the board even after through-hole parts have been put into place A similar principle to pin transfer is used for the application of flux on the solder ball of FC components for DCA (See Fig 4014) The die is immersed into a thin film bath of flux The flux depth allows only the balls to be coated so that, in effect, the solder balls become the pin, taking up the flux The flux on the solder balls is transferred with the die to the circuit board, where it provides the tack function as well as fluxing action for the solder balls during the reflow step An important consideration about the pin transfer technique is that it requires an open bath of the adhesive or flux Adhesives readily absorb water from the air.

Fluxes lose vehicle (water or alcohol) and possibly other constituents through evaporation By either mechanism, the material properties change, which affects the quantity of fluid retained on the pin and deposited at the site (including the flip-chip process previously described) Adhesives must have sufficient wet strength, and the fluxes must have enough tack to hold the component in place for the duration of component placement activity as well as subsequent handling of the circuit board on its way to the curing oven or reflow oven Screen or stencil printing can be used for adhesives as well as solder paste The low viscosity of most flux solutions precludes their successful dispensing by this technique The adhesive or solder paste is deposited through openings in the stencil or screen called apertures The apertures are located over the locations on the circuit board where the adhesive or solder paste is required.

The placement of material is performed by a squeegee pushing a quantity of adhesive or paste ahead of it, over the screen or stencil, as illustrated by Fig 4016a..

FIGURE 40.16 Screen and stencil printing: (a) the squeegee movement used to print adhesive or paste through a screen or stencil; the construction of a screen (b) and stencil (c) used for printing.

The difference between a screen and a stencil is in their respective structures, as shown in Fig. 40.16b, c. The screen is comprised of two layers: the emulsion layer and the actual screen that supports the emulsion layer. The apertures through which the adhesive or solder paste is deposited are created in the emulsion by photoimaging techniques. The adhesive or solder paste simply flows past the screen cross-hatched wires. The stencil is simply a sheet of metal or alloy (commonly Mo, Ni, brass, or stainless steel) having the apertures formed in them. The apertures can be created by one or a combination of the following techniques:

(a) (b)

Photoimaging (photoresist definition) combined with etching by wet chemistry Laser cutting Build-up technology by electroplating processes