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To obtain similar throughputs for through-hole circuit boards, paste-in-hole soldering is being investigated as an alternative to wave soldering Solder is provided to the joint in the form of a paste, using screen or stencil printing, or dispensed from a needle The component is then inserted into the hole In some applications, the parts are inserted into the circuit board and subsequently the solder is dispensed at the hole using a needle and pump Then the assembly is sent through the reflow furnace The primary hurdle with paste-in-hole soldering is supplying a quantity of paste that is sufficient not only to develop a fillet on that side of the joint, but also to fill the hole and, optimistically, create a fillet on the bottom side of two-sided and multilayer circuit boards A second concern for paste-in-hole soldering is the temperature sensitivity of the throughhole components.

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Recall that in wave, selective, or even hand soldering, the temperature rise is confined largely to the leads and circuit board At worst, the component package materials experience only the preheat temperature environment However, in paste-in-hole soldering, components must withstand the soldering temperatures within the reflow furnace Therefore, a conversion to this solder process requires an in-depth review of the allowable temperature range for all of the components 4028 Cleaning The final step in the soldering process is the removal of flux residues from the completed circuit board No-clean fluxes, as the name implies, produce residues that need not be removed from the assembly after soldering The corrosive activators are locked up in a hard, polymerized residue However, no-clean flux residues can potentially interfere with in-circuit testing (probes) and inspection, degrade cosmetic appearance, inhibit rework activities, and lessen the adhesion of conformal coatings.

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In the event that any one of these factors becomes critical, it is best to switch to a cleanable flux than to develop a cleaning process for a no-clean flux Low-solids fluxes (which are not to be confused with no-clean fluxes) are simply formulated with reduced solids content so that very little residue is left on the circuit board Lowsolids flux can be successfully used in wave-soldering and paste-in-hole processes, thereby eliminating the need for a cleaning step However, they are somewhat more difficult to use in hand-soldering processes because the higher temperature of the soldering iron tip can cause premature loss of the activating agent, resulting in poor solderability..

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The cleaning step can be performed in either a batch or inline machine. The optimum equipment is determined by production volumes, floor space, and capital expenditure costs. Smaller, batch cleaning (or dishwasher ) machines are very cost-effective for overall batchtype processes (e.g., hand soldering) as well as for circuit boards assembled in low production volumes. Inline cleaning equipment is placed at the end of the soldering assembly line to accommodate high production volumes. Whether batch or inline equipment is used, an equally important consideration is selecting the type of cleaning solution. Solvent-based, aqueous, and semi-aqueous cleaning materials are commercially available that meet environmental regulations and provide adequate efficacy for the removal of flux residues. The impact of Pb-free soldering on the cleaning step depends on the particular assembly process. By virtue that the same pot temperatures are used in Pb-free wave soldering as are specified for Sn-Pb solder, there is no added thermal degradation to the flux residues that would cause them to be more difficult to remove from the circuit board surfaces. Such degradation may be observed, albeit to a limited extent, with hand assembly due to slightly longer soldering times. Thermal effects are potentially most significant with paste-in-hole soldering because of the increased temperature settings of the reflow furnace required to melt Pb-free alloys.

Surface-mount technology refers to assemblies that have components soldered to pads on the surfaces of the circuit board. Components may populate only one side (single-sided) or both sides (double-sided) of the circuit board. Surface-mount technology dates back to the 1960s, when it was developed for hybrid microcircuit (HMC) assemblies for which it was difficult to put holes into the ceramic substrates. The advent of surface-mount technology for laminate substrates, though, is relatively recent (c. 1980). The advantages of surface-mount technology include smaller components and greater board densities. The large holes have been replaced by small vias for signal conduction between sides and internal layers. Finer traces and reduced component heights also contribute to increased circuit board miniaturization and functionality. Surface-mount circuit boards are shown in Fig. 40.10.

Always know your opening line. This will reduce your anxiety and help you get off on the right foot.

FIGURE 40.10 Surface-mount technology circuit boards showing the range of passive and active device sizes and geometries. (Courtesy of Sandia National Laboratories and American Competitiveness Institute.)

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