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Margulies and J E Kressbach, 1961 28 E B Saubestre, Ind Eng Chem, vol 51, 1959, pp 288 290 29 W F Nekervis, The Use of Ferric Chloride in the Etching of Copper, Dow Chemical Co, Midland, MI, 1962 30 US Patent 4,482,425, J F Battey, 1984 31 US Patent 4,497,687, N J Nelson, 1985 32 Don Ball, The Surface Mechanics of Fine-Line Etching, Printed Circuit Fabrication, vol 21, no 11, 1998 33 F T Mansur and R G Autiello, Insulation, March 1968, pp 58 61 34 H R Johnson and J W Dini, Insulation, August 1975, p 31 35 P F Kury, J Electrochem Soc, vol 103, 1956, p 257 36 Marshall Gurian, Process Effects Analysis for Fine Line Production, IPC Paper WCIV-28, Printed Circuit World Convention IV, Tokyo, 1987 37 Marshall Gurian, Reliable Fine Line Wet Processing, Printed Circuit Fabrication, vol 10, no.

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12, 1987 38 Marshall Gurian, Fine Line Processing: The 90 s Are Here! Printed Circuit Fabrication, vol 13, no 5, 1990 39 US Patent 5,904,863, Michael Hatfield and Marshall Gurian 40 Michael Brassard and Diane Ritter, The Memory Jogger II, Goal/QPC, Methuen, MA 41 Yasuo Tanaka, Hireyuki Urabe, and Morio Gaku, Three Micron Copper Foil Clad Laminate for 30/30 Micron Line/Space Circuit, CircuiTree, vol 10, no 11, 1997 42 Igor Kadija and James Russel, New Wet Processing for HDI s, CircuiTree, vol 12, no 5, 1999 43 US Patents 5,024,735, 5,114,558, and 5,167,747, Igor Kadija 44 Karl Dietz, Process and Material Adaptations for HDI Requirements, CircuiTree, vol 13, no 12, 2000 45 US Patent 4,607,590, Don Pender 46 Marshall Gurian, Rinsing as a Process Technology, Paper T14, Proceedings of the Printed Circuit World Convention VI, 1993; summarized in Printed Circuit Fabrication, vol 20, no 7, 1997..

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Laminate machining consists of the mechanical processes by which circuit boards are prepared for the vital chemical processes of image transfer, plating, and etching. Such processes as cutting to size, drilling holes, and shaping have major effects on the final quality of the printed board. This chapter will discuss the basic mechanical processes that are essential to producing the finished board.

35.2 PUNCHING HOLES (PIERCING)

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35.2.1 Design of the Die It is possible to pierce holes down to one-half the thickness of XXXPC and FR-2 laminates and one-third that of FR-3 (Fig. 35.1). Many die designers lose sight of the fact that the force required to withdraw piercing punches is of the same magnitude as that required to push the punches through the material. For that reason, the question of how much stripperspring pressure to design into a die is answered by most toolmakers: as much as possible. When space on the dies cannot accommodate enough mechanical springs to do the job, a hydraulic mechanism can be used. Springs should be so located that the part is stripped evenly. If the board is ejected from the die unevenly, cracks around holes are almost certain to occur. Best-quality holes are produced when the stripper compresses the board an instant before the perforators start to penetrate. If the stripper pressure can be made to approach the compressive strength of the material, less force will be required and the holes will be cleaner. If excessive breakage of small punches occurs, determine whether the punch breaks on the perforating stroke or on withdrawal. If the retainer lock is breaking, the cause is almost certain to be withdrawal strain. The remedy is to grind a small taper on the punch, no more than 11.2 in. and to a distance no greater than the thickness of the material being punched. If the grinding is kept within those limits, it will have no measurable effect on hole quality or size. The other two causes of punch breakage are poor alignment, which is easily detected by close examination of the tool, and poor design, which usually means that the punch is too small to do the job required.

When paper-based laminates are to be punched, it must be remembered that the materials are resilient and that their tendency to spring back will result in a hole slightly smaller than the punch that produced the hole. The difference in size will depend on the thickness of the material. Table 35.1 shows the amount by which the punch should exceed the print size in order to make the holes within tolerance. The values listed should not be used for the design of tools for glass-epoxy laminates, the shrinkage of which is only about one-third that of paper-based materials.

FIGURE 35.1 Illustration of the proper sizing and locating of pierced holes with respect to one another and to the edge of paper laminates. Minimum dimensions are given as multiples of laminate thickness t.

TABLE 35.1 Shrinkage in Punched Hole Diameters, Paper-Base Laminates Material at thickness 1.64 1.32 3.64 1.16 3.32 1.80 Material at room temp. 0.001 0.002 0.003 0.004 0.006 0.010 Material at 90 F or above 0.002 0.003 0.005 0.007 0.010 0.013

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